Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157772 | Semiconductor packaging structure and process | Kuan-Lin Ho, Chin-Liang Chen, Yu-Chih Liu, Shih-Yen Lin | 2018-12-18 |
| 10118193 | Light curing apparatus | Kai Hu | 2018-11-06 |
| 10085204 | Data transmission system and communication method | Chi-Kang Chiang, Ru-Me Na Jiang, Al-Guo Cheng, Ko-Yi Lee, Ping-Chuan Tsai +2 more | 2018-09-25 |
| 10061965 | Fingerprint sensing unit and fingerprint sensing module | Shih-Chun Kuo | 2018-08-28 |
| 10043761 | Semiconductor device and manufacturing method thereof | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2018-08-07 |
| 9893043 | Method of manufacturing a chip package | Chin-Liang Chen, Yu-Chih Liu, Kuan-Lin Ho, Shih-Yen Lin | 2018-02-13 |
| 9887144 | Ring structure for chip packaging | Wen-Yi Lin, Yu-Chih Liu, Ming-Chih Yew, Tsung-Shu Lin, Bor-Rung Su +1 more | 2018-02-06 |
| 9859265 | Package structure and methods of forming the same | Yu-Chih Liu, Kuan-Lin Ho, Chin-Liang Chen, Jing Ruei Lu | 2018-01-02 |