Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10164122 | Semiconductor device with transition metal dichalocogenide hetero-structure | Chi-Wen Liu, Chong-Rong Wu, Xiang-Rui Chang | 2018-12-25 |
| 10157737 | Semiconductor devices comprising 2D-materials and methods of manufacture thereof | Meng-Yu Lin, Si-Chen Lee, Samuel C. Pan | 2018-12-18 |
| 10157772 | Semiconductor packaging structure and process | Kuan-Lin Ho, Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu | 2018-12-18 |
| 10147603 | Method of manufacturing a FET using a two dimensional transition metal dichalcogenide including a low power oxygen plasma treatment | Chi-Wen Liu, Si-Chen Lee, Chong-Rong Wu, Kuan-Chao CHEN | 2018-12-04 |
| 9899537 | Semiconductor device with transition metal dichalocogenide hetero-structure | Chi-Wen Liu, Chong-Rong Wu, Xian-Rui Chang | 2018-02-20 |
| 9893043 | Method of manufacturing a chip package | Chin-Liang Chen, Yu-Chih Liu, Kuan-Lin Ho, Wei-Ting Lin | 2018-02-13 |
| 9859115 | Semiconductor devices comprising 2D-materials and methods of manufacture thereof | Meng-Yu Lin, Si-Chen Lee, Samuel C. Pan | 2018-01-02 |