Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163754 | Lid design for heat dissipation enhancement of die package | Kuan-Lin Ho, Sheng-Hsiang Chiu, Hsin-Yu Pan, Chin-Liang Chen | 2018-12-25 |
| 10157772 | Semiconductor packaging structure and process | Kuan-Lin Ho, Chin-Liang Chen, Wei-Ting Lin, Shih-Yen Lin | 2018-12-18 |
| 10157863 | Method for forming a lid structure for a semiconductor device package | Kuan-Lin Ho, Chin-Liang Chen, Chi-Yang Yu | 2018-12-18 |
| 9893043 | Method of manufacturing a chip package | Chin-Liang Chen, Kuan-Lin Ho, Wei-Ting Lin, Shih-Yen Lin | 2018-02-13 |
| 9887144 | Ring structure for chip packaging | Wen-Yi Lin, Ming-Chih Yew, Tsung-Shu Lin, Bor-Rung Su, Jing Ruei Lu +1 more | 2018-02-06 |
| 9859265 | Package structure and methods of forming the same | Kuan-Lin Ho, Wei-Ting Lin, Chin-Liang Chen, Jing Ruei Lu | 2018-01-02 |