Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10008480 | Package-on-package structure with through molding via | Fu-Jen Li, Po-Yao Lin, Kuo-Chuan Liu | 2018-06-26 |
| 9887144 | Ring structure for chip packaging | Wen-Yi Lin, Yu-Chih Liu, Tsung-Shu Lin, Bor-Rung Su, Jing Ruei Lu +1 more | 2018-02-06 |