Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10008480 | Package-on-package structure with through molding via | Ming-Chih Yew, Po-Yao Lin, Kuo-Chuan Liu | 2018-06-26 |
FL
Fu-Jen Li
Overall (2018): #416,851 of 503,207Top 85%
1
Patents 2018