Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163862 | Package structure and method for forming same | Hsien-Wei Chen | 2018-12-25 |
| 10067181 | Testing holders for chip unit and die package | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Hao Chen | 2018-09-04 |
| 10008480 | Package-on-package structure with through molding via | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin | 2018-06-26 |