Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163816 | Structure and formation method of chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Shyue-Ter Leu, Shin-Puu Jeng | 2018-12-25 |
| 10109547 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Shyue-Ter Leu, Shin-Puu Jeng, Chih-Kung Huang, Tsung-Ming Yeh | 2018-10-23 |
| 10008480 | Package-on-package structure with through molding via | Ming-Chih Yew, Fu-Jen Li, Kuo-Chuan Liu | 2018-06-26 |
| 9881908 | Integrated fan-out package on package structure and methods of forming same | Wen-Yi Lin, Hsien-Wen Liu, Cheng-Lin Huang, Shyue-Ter Leu, Shin-Puu Jeng | 2018-01-30 |
| 9870975 | Chip package with thermal dissipation structure and method for forming the same | Chin-Hua Wang, Shu-Shen Yeh, Kuang-Chun Lee, Shin-Puu Jeng, Shyue-Ter Leu +2 more | 2018-01-16 |