Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141043 | DRAM and method for managing power thereof | Chung-Hsun Lee | 2018-11-27 |
| 10127967 | DRAM and method for operating the same | Chung-Hsun Lee | 2018-11-13 |
| 10083949 | Using metal-containing layer to reduce carrier shock in package formation | Shin-Puu Jeng, Yi-Jou Lin | 2018-09-25 |
| 10074617 | Wafer level package (WLP) and method for forming the same | Shin-Puu Jeng | 2018-09-11 |
| 10074637 | Structure and formation method for chip package | Jui-Pin Hung, Cheng-Lin Huang, Shin-Puu Jeng | 2018-09-11 |
| 10049714 | DRAM and method for managing power thereof | Chung-Hsun Lee | 2018-08-14 |
| 10019350 | Dram and method for accessing a dram | Chung-Hsun Lee | 2018-07-10 |
| 9950450 | Molding chamber apparatus and curing method | Jing-Cheng Lin, Chen-Hua Yu, Shin-Puu Jeng, Jui-Pin Hung | 2018-04-24 |
| 9881908 | Integrated fan-out package on package structure and methods of forming same | Wen-Yi Lin, Po-Yao Lin, Cheng-Lin Huang, Shyue-Ter Leu, Shin-Puu Jeng | 2018-01-30 |