Issued Patents 2018
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163836 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2018-12-25 |
| 10153175 | Metal oxide layered structure and methods of forming the same | Jing-Cheng Lin | 2018-12-11 |
| 10134701 | Solder bump for ball grid array | Jung-Hua Chang, Jing-Cheng Lin | 2018-11-20 |
| 10115647 | Non-vertical through-via in package | Jung-Hua Chang, Jy-Jie Gau, Jing-Cheng Lin | 2018-10-30 |
| 10074637 | Structure and formation method for chip package | Jui-Pin Hung, Hsien-Wen Liu, Shin-Puu Jeng | 2018-09-11 |
| 10014218 | Method for forming semiconductor device structure with bumps | Meng-Fu Shih, Chien-Chen Li, Che-Jung Chu, Wen-Ming Chen, Kuo-Chio Liu | 2018-07-03 |
| 9953948 | Pillar design for conductive bump | Cheng-Chieh Hsieh, Po-Hao Tsai, Shang-Yun Hou, Jing-Cheng Lin, Shin-Puu Jeng | 2018-04-24 |
| 9881908 | Integrated fan-out package on package structure and methods of forming same | Wen-Yi Lin, Hsien-Wen Liu, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2018-01-30 |
| 9875979 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2018-01-23 |
| 9870975 | Chip package with thermal dissipation structure and method for forming the same | Chin-Hua Wang, Po-Yao Lin, Shu-Shen Yeh, Kuang-Chun Lee, Shin-Puu Jeng +2 more | 2018-01-16 |