Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163836 | Conductive external connector structure and method of forming | Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2018-12-25 |
| 10014218 | Method for forming semiconductor device structure with bumps | Cheng-Lin Huang, Chien-Chen Li, Che-Jung Chu, Wen-Ming Chen, Kuo-Chio Liu | 2018-07-03 |
| 9875979 | Conductive external connector structure and method of forming | Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2018-01-23 |