Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163849 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2018-12-25 |
| 10115686 | Semiconductor structure and fabricating method thereof | Wei-Li Huang, Jheng-Jie Wong, Hsiang-Sheng Su, Tsung Lung Huang, Hsin-Chieh Huang +3 more | 2018-10-30 |
| 10014218 | Method for forming semiconductor device structure with bumps | Meng-Fu Shih, Cheng-Lin Huang, Chien-Chen Li, Che-Jung Chu, Wen-Ming Chen | 2018-07-03 |