HH

Hsin-Chieh Huang

TSMC: 17 patents #63 of 2,904Top 3%
CO Chun Kuang Optics: 3 patents #1 of 4Top 25%
Overall (2018): #1,513 of 503,207Top 1%
20
Patents 2018

Issued Patents 2018

Showing 1–20 of 20 patents

Patent #TitleCo-InventorsDate
10164059 FinFET device and fabricating method thereof Yen-Ming Peng, Chi-Wen Liu, Yi-Ju Hsu, Horng-Huei Tseng 2018-12-25
10164072 Semiconductor device and manufacturing method thereof Chih-Sheng Li, Chi-Wen Liu 2018-12-25
10164071 FinFET device and fabricating method thereof Yen-Ming Peng, Chi-Wen Liu, Yi-Ju Hsu, Horng-Huei Tseng 2018-12-25
10163745 Package with tilted interface between device die and encapsulating material Ming-Yen Chiu, Ching Fu Chang 2018-12-25
10163717 Method of forming FinFET device by adjusting etch selectivity of dielectric layer Chih-Sheng Li, Chi-Wen Liu 2018-12-25
10151452 Variable focus lighting fixture Shun Wang, Shun-Wen Teng 2018-12-11
10128182 Semiconductor package structure and manufacturing method thereof Hsi-Kuei Cheng, Chih-Kang Han, Ching Fu Chang 2018-11-13
10115686 Semiconductor structure and fabricating method thereof Wei-Li Huang, Jheng-Jie Wong, Hsiang-Sheng Su, Tsung Lung Huang, Kuo-Chio Liu +3 more 2018-10-30
10109589 Integrated fan-out package and method of fabricating the same Ming-Yen Chiu, Ching Fu Chang 2018-10-23
10083921 Power transistor die Yu-Syuan Lin, Jiun-Lei Jerry Yu, Ming-Cheng Lin, Chao-Hsiung Wang 2018-09-25
10077883 Illumination device with optical units including spiral structure optical unit and illumination device having the same Shun-Wen Teng, Shun Wang 2018-09-18
10050148 Semiconductor device and method of forming the same Chia-Ming Chang, Chi-Wen Liu, Cheng-Chien Li 2018-08-14
10037961 Integrated fan-out package and method of fabricating the same Ming-Yen Chiu, Ching Fu Chang 2018-07-31
10032873 Semiconductor device and method of forming the same Chia-Ming Chang, Chi-Wen Liu, Cheng-Chien Li 2018-07-24
10025077 Device for measuring solution concentration Cheng Yu Huang, Shun Wang, Shun-Wen Teng 2018-07-17
9941216 Conductive pattern and integrated fan-out package having the same Ming-Yen Chiu, Ching Fu Chang, Chien-Chia Chiu, Tsung-Shu Lin, Pei-Ti Yu 2018-04-10
9933388 Integrated biosensor Chun-Wen Cheng, Fei-Lung Lai, Chia-Hua Chu, Yi-Hsien Chang 2018-04-03
9922895 Package with tilted interface between device die and encapsulating material Ming-Yen Chiu, Ching Fu Chang 2018-03-20
9922896 Info structure with copper pillar having reversed profile Hsi-Kuei Cheng, Ching Fu Chang, Chih-Kang Han 2018-03-20
9905467 Semiconductor device and manufacturing method thereof Chih-Sheng Li, Chi-Wen Liu 2018-02-27