Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163843 | Semiconductor device structure and manufacturing method | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen | 2018-12-25 |
| 10128182 | Semiconductor package structure and manufacturing method thereof | Chih-Kang Han, Ching Fu Chang, Hsin-Chieh Huang | 2018-11-13 |
| 10090267 | Bump structure and method for forming the same | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen | 2018-10-02 |
| 9997482 | Solder stud structure | Li-Guo Lee, Yi-Chen Liu, Yung S. Liu, Yi-Jen Lai, Chun-Jen Chen | 2018-06-12 |
| 9922896 | Info structure with copper pillar having reversed profile | Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang | 2018-03-20 |