Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163745 | Package with tilted interface between device die and encapsulating material | Ming-Yen Chiu, Hsin-Chieh Huang | 2018-12-25 |
| 10128182 | Semiconductor package structure and manufacturing method thereof | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2018-11-13 |
| 10109589 | Integrated fan-out package and method of fabricating the same | Ming-Yen Chiu, Hsin-Chieh Huang | 2018-10-23 |
| 10037961 | Integrated fan-out package and method of fabricating the same | Ming-Yen Chiu, Hsin-Chieh Huang | 2018-07-31 |
| 9941216 | Conductive pattern and integrated fan-out package having the same | Ming-Yen Chiu, Chien-Chia Chiu, Hsin-Chieh Huang, Tsung-Shu Lin, Pei-Ti Yu | 2018-04-10 |
| 9922895 | Package with tilted interface between device die and encapsulating material | Ming-Yen Chiu, Hsin-Chieh Huang | 2018-03-20 |
| 9922896 | Info structure with copper pillar having reversed profile | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2018-03-20 |