Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128182 | Semiconductor package structure and manufacturing method thereof | Hsi-Kuei Cheng, Ching Fu Chang, Hsin-Chieh Huang | 2018-11-13 |
| 9922896 | Info structure with copper pillar having reversed profile | Hsi-Kuei Cheng, Ching Fu Chang, Hsin-Chieh Huang | 2018-03-20 |