Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163861 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh | 2018-12-25 |
| 10163745 | Package with tilted interface between device die and encapsulating material | Hsin-Chieh Huang, Ching Fu Chang | 2018-12-25 |
| 10109589 | Integrated fan-out package and method of fabricating the same | Ching Fu Chang, Hsin-Chieh Huang | 2018-10-23 |
| 10068867 | Post-passivation interconnect structure and methods thereof | Chien-Chia Chiu | 2018-09-04 |
| 10068844 | Integrated fan-out structure and method of forming | Hsien-Wei Chen | 2018-09-04 |
| 10037961 | Integrated fan-out package and method of fabricating the same | Ching Fu Chang, Hsin-Chieh Huang | 2018-07-31 |
| 9941216 | Conductive pattern and integrated fan-out package having the same | Ching Fu Chang, Chien-Chia Chiu, Hsin-Chieh Huang, Tsung-Shu Lin, Pei-Ti Yu | 2018-04-10 |
| 9922895 | Package with tilted interface between device die and encapsulating material | Hsin-Chieh Huang, Ching Fu Chang | 2018-03-20 |