Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163861 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Ming-Yen Chiu | 2018-12-25 |
| 10164133 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu +2 more | 2018-12-25 |
| 10153218 | Semiconductor structure and manufacturing method thereof | Tsung-Yu Chen, Wensen Hung, Hung-Chi Li, Tung-Liang Shao, Chih-Hang Tung | 2018-12-11 |
| 10062664 | Semiconductor packaging device with heat sink | — | 2018-08-28 |
| 9953948 | Pillar design for conductive bump | Cheng-Lin Huang, Po-Hao Tsai, Shang-Yun Hou, Jing-Cheng Lin, Shin-Puu Jeng | 2018-04-24 |