Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163828 | Semiconductor device and fabricating method thereof | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Yu-Chia Lai | 2018-12-25 |
| 10153218 | Semiconductor structure and manufacturing method thereof | Tsung-Yu Chen, Wensen Hung, Hung-Chi Li, Cheng-Chieh Hsieh, Chih-Hang Tung | 2018-12-11 |
| 10141291 | Semiconductor device and method of manufacturing the same | Chih-Hang Tung, Chen-Hua Yu | 2018-11-27 |
| 10068868 | Multi-strike process for bonding packages and the packages thereof | Chih-Hang Tung, Wen-Lin Shih, Hsiao-Yun Chen, Chen-Hua Yu | 2018-09-04 |
| 10032737 | Semiconductor device and manufacturing method thereof | Yu-Chia Lai, Hsien-Ming Tu, Chang-Pin Huang, Ching-Jung Yang | 2018-07-24 |
| 9997467 | Semiconductor packages and methods of forming the same | Chih-Hang Tung, Chen-Hua Yu | 2018-06-12 |
| 9947630 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai | 2018-04-17 |
| 9893046 | Thinning process using metal-assisted chemical etching | Su-Chun Yang, Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu | 2018-02-13 |