Issued Patents 2018
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163821 | Packaging devices and methods for semiconductor devices | — | 2018-12-25 |
| 10157818 | Methods of cooling packaged semiconductor devices | Kim Hong Chen, Szu-Po Huang, Shin-Puu Jeng | 2018-12-18 |
| 10157813 | 3DIC packaging with hot spot thermal management features | Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2018-12-18 |
| 10153218 | Semiconductor structure and manufacturing method thereof | Tsung-Yu Chen, Hung-Chi Li, Cheng-Chieh Hsieh, Tung-Liang Shao, Chih-Hang Tung | 2018-12-11 |
| 10062665 | Semiconductor packages with thermal management features for reduced thermal crosstalk | Kim Hong Chen, Szu-Po Huang, Shin-Puu Jeng | 2018-08-28 |
| 9985001 | 3DIC package and methods of forming the same | Kim Hong Chen, Szu-Po Huang, Shin-Puu Jeng | 2018-05-29 |
| 9978660 | Package with embedded heat dissipation features | Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2018-05-22 |
| 9941251 | 3DIC packages with heat dissipation structures | Szu-Po Huang, Kim Hong Chen, Shin-Puu Jeng | 2018-04-10 |
| 9891273 | Test structures and testing methods for semiconductor devices | Yung-Hsin Kuo, Po-Shi Yao | 2018-02-13 |
| 9893021 | Packaging devices and methods for semiconductor devices | — | 2018-02-13 |