Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157813 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2018-12-18 |
| 10157818 | Methods of cooling packaged semiconductor devices | Kim Hong Chen, Shin-Puu Jeng, Wensen Hung | 2018-12-18 |
| 10062665 | Semiconductor packages with thermal management features for reduced thermal crosstalk | Kim Hong Chen, Wensen Hung, Shin-Puu Jeng | 2018-08-28 |
| 9985001 | 3DIC package and methods of forming the same | Kim Hong Chen, Shin-Puu Jeng, Wensen Hung | 2018-05-29 |
| 9978660 | Package with embedded heat dissipation features | Wensen Hung, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2018-05-22 |
| 9941251 | 3DIC packages with heat dissipation structures | Wensen Hung, Kim Hong Chen, Shin-Puu Jeng | 2018-04-10 |