Issued Patents 2018
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163835 | Solder bump stretching method | Su-Chun Yang, Yi-Li Hsiao, Chen-Hua Yu | 2018-12-25 |
| 10153218 | Semiconductor structure and manufacturing method thereof | Tsung-Yu Chen, Wensen Hung, Hung-Chi Li, Cheng-Chieh Hsieh, Tung-Liang Shao | 2018-12-11 |
| 10141291 | Semiconductor device and method of manufacturing the same | Tung-Liang Shao, Chen-Hua Yu | 2018-11-27 |
| 10068868 | Multi-strike process for bonding packages and the packages thereof | Tung-Liang Shao, Wen-Lin Shih, Hsiao-Yun Chen, Chen-Hua Yu | 2018-09-04 |
| 10034390 | Metal post bonding using pre-fabricated metal posts | Yi-Li Hsiao, Su-Chun Yang, Da-Yuan Shih, Chen-Hua Yu | 2018-07-24 |
| 9997467 | Semiconductor packages and methods of forming the same | Tung-Liang Shao, Chen-Hua Yu | 2018-06-12 |
| 9978709 | Solder bump stretching method for forming a solder bump joint in a device | Su-Chun Yang, Chung-Jung Wu, Hsiao-Yun Chen, Yi-Li Hsiao, Da-Yuan Shih +1 more | 2018-05-22 |
| 9960134 | Semiconductor device and bump formation process | Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Cheng-Chang Wei | 2018-05-01 |
| 9893046 | Thinning process using metal-assisted chemical etching | Su-Chun Yang, Yi-Li Hsiao, Tung-Liang Shao, Chen-Hua Yu | 2018-02-13 |
| 9881888 | Manufacturing method of interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-01-30 |