Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9978709 | Solder bump stretching method for forming a solder bump joint in a device | Su-Chun Yang, Hsiao-Yun Chen, Yi-Li Hsiao, Chih-Hang Tung, Da-Yuan Shih +1 more | 2018-05-22 |