Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163835 | Solder bump stretching method | Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu | 2018-12-25 |
| 10034390 | Metal post bonding using pre-fabricated metal posts | Yi-Li Hsiao, Chih-Hang Tung, Da-Yuan Shih, Chen-Hua Yu | 2018-07-24 |
| 9978709 | Solder bump stretching method for forming a solder bump joint in a device | Chung-Jung Wu, Hsiao-Yun Chen, Yi-Li Hsiao, Chih-Hang Tung, Da-Yuan Shih +1 more | 2018-05-22 |
| 9893046 | Thinning process using metal-assisted chemical etching | Yi-Li Hsiao, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu | 2018-02-13 |