Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068868 | Multi-strike process for bonding packages and the packages thereof | Tung-Liang Shao, Chih-Hang Tung, Wen-Lin Shih, Chen-Hua Yu | 2018-09-04 |
| 9978709 | Solder bump stretching method for forming a solder bump joint in a device | Su-Chun Yang, Chung-Jung Wu, Yi-Li Hsiao, Chih-Hang Tung, Da-Yuan Shih +1 more | 2018-05-22 |