Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163835 | Solder bump stretching method | Su-Chun Yang, Chih-Hang Tung, Chen-Hua Yu | 2018-12-25 |
| 10147693 | Methods for stud bump formation | Chien Ling Hwang, Yeong-Jyh Lin, Ming-Da Cheng, Tsai-Tsung Tsai, Chung-Shi Liu +2 more | 2018-12-04 |
| 10034390 | Metal post bonding using pre-fabricated metal posts | Su-Chun Yang, Chih-Hang Tung, Da-Yuan Shih, Chen-Hua Yu | 2018-07-24 |
| 9978709 | Solder bump stretching method for forming a solder bump joint in a device | Su-Chun Yang, Chung-Jung Wu, Hsiao-Yun Chen, Chih-Hang Tung, Da-Yuan Shih +1 more | 2018-05-22 |
| 9966357 | Pick-and-place tool for packaging process | Chien Ling Hwang, Ying-Jui Huang | 2018-05-08 |
| 9960134 | Semiconductor device and bump formation process | Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei | 2018-05-01 |
| 9893046 | Thinning process using metal-assisted chemical etching | Su-Chun Yang, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu | 2018-02-13 |