Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157881 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Hsiao-Chung Liang, Chung-Shi Liu | 2018-12-18 |
| 10147693 | Methods for stud bump formation | Chien Ling Hwang, Yi-Li Hsiao, Ming-Da Cheng, Tsai-Tsung Tsai, Chung-Shi Liu +2 more | 2018-12-04 |
| 10056285 | Semiconductor wafer device and manufacturing method thereof | Bor-Ping Jang, Chien Ling Hwang, Hsin-Hung Liao | 2018-08-21 |
| 9929118 | Packaging through pre-formed metal pins | Chen-Hua Yu, Chien Ling Hwang | 2018-03-27 |
| 9917069 | Hybrid bonding system and cleaning method thereof | Ping-Yin Liu, Xin-Hua Huang, Chia-Shiung Tsai | 2018-03-13 |
| 9893044 | Wafer-level underfill and over-molding | Bor-Ping Jang, Chung-Shi Liu, Chien Ling Hwang | 2018-02-13 |