Issued Patents 2018
Showing 1–25 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163972 | Image sensing device with photon blocking layer and anti-reflective coating | Hung-Wen Hsu, Jung-I Lin, Ching-Chung Su, Jiech-Fun Lu, Yeur-Luen Tu | 2018-12-25 |
| 10164184 | Resistance variable memory structure and method of forming the same | Fu-Ting Sung, Ching-Pei Hsieh, Chern-Yow Hsu, Shih-Chang Liu | 2018-12-25 |
| 10157820 | Methods for manufacturing a thin film resistor over interconnect pads | Yuan-Tai Tseng, Chung-Yen Chou, Ming Chyi Liu | 2018-12-18 |
| 10158069 | Memory cell having resistance variable film and method of making the same | Ching-Pei Hsieh, Chern-Yow Hsu, Fu-Ting Sung, Shih-Chang Liu | 2018-12-18 |
| 10157994 | High electron mobility transistor and method of forming the same | Han-Chin Chiu, Chi-Ming Chen, Chung-Yi Yu | 2018-12-18 |
| 10157706 | Inductor structure with magnetic material | Yuan-Tai Tseng, Ming Chyi Liu, Chung-Yen Chou | 2018-12-18 |
| 10155214 | Getter, MEMS device and method of forming the same | Chin-Wei Liang, Cheng-Yuan Tsai, Chun-Wen Cheng | 2018-12-18 |
| 10147794 | Split gate memory device and method of fabricating the same | Chang-Ming Wu, Wei-Cheng Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang | 2018-12-04 |
| 10138118 | Structure to reduce backside silicon damage | Chung-Yen Chou, Chih-Jen Chan, Ru-Liang Lee, Yuan-Chih Hsieh | 2018-11-27 |
| 10134945 | Wafer to wafer bonding techniques for III-V wafers and CMOS wafers | Ming Chyi Liu, Chen-Hua Yu, Alexander Kalnitsky, Ru-Liang Lee, Eugene Chen | 2018-11-20 |
| 10128113 | Semiconductor structure and manufacturing method thereof | Shih Pei Chou, Chen-Fa Lu, Jiech-Fun Lu, Yeur-Luen Tu | 2018-11-13 |
| 10119909 | Biological sensing structures | Hung-Hua Lin, Li-Cheng Chu, Ming-Tung Wu, Yuan-Chih Hsieh, Lan-Lin Chao | 2018-11-06 |
| 10109756 | Backside illuminated photo-sensitive device with gradated buffer layer | Yu-Hung Cheng, Cheng-Ta Wu, Xiaomeng Chen, Yen-Chang Chu, Yeur-Luen Tu | 2018-10-23 |
| 10103122 | Hybrid bonding systems and methods for semiconductor wafers | Ping-Yin Liu, Shih-Wei Lin, Xin-Hua Huang, Lan-Lin Chao | 2018-10-16 |
| 10090196 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao +2 more | 2018-10-02 |
| 10079257 | Anti-reflective layer for backside illuminated CMOS image sensors | Hsing-Lien Lin, Yeur-Luen Tu, Cheng-Yuan Tsai, Cheng-Ta Wu | 2018-09-18 |
| 10079296 | High electron mobility transistor with indium nitride layer | Chen-Hao Chiang, Po-Chun Liu, Chi-Ming Chen, Min-Chang Ching, Chung-Yi Yu +1 more | 2018-09-18 |
| 10074537 | Method of forming semiconductor structure having sets of III-V compound layers | Chi-Ming Chen, Po-Chun Liu, Chung-Yi Yu | 2018-09-11 |
| 10049890 | Semiconductor structure and method of manufacturing the same | Chung-Yen Chou, Chih-Jen Chan, Shih-Chang Liu | 2018-08-14 |
| 10012899 | Graphene pellicle for extreme ultraviolet lithography | Chih-Chiang Tu, Chun-Lang Chen, Chue-San Yoo, Jong-Yuh Chang, Ping-Yin Liu +3 more | 2018-07-03 |
| 10008546 | Image sensors with organic photodiodes and methods for forming the same | Chin-Wei Liang, Cheng-Yuan Tsai, Hsing-Lien Lin | 2018-06-26 |
| 10008506 | Semiconductor arrangement with capacitor | Chern-Yow Hsu, Chen-Jong Wang, Shih-Chang Liu, Xiaomeng Chen | 2018-06-26 |
| 10008531 | Varied STI liners for isolation structures in image sensing devices | Cheng-Hsien Chou, Feng-Chi Hung, Jiech-Fun Lu, Min-Feng Kao, Shih Pei Chou +1 more | 2018-06-26 |
| 10003022 | RRAM cell structure with conductive etch-stop layer | Ming Chyi Liu, Yuan-Tai Tseng, Chern-Yow Hsu, Shih-Chang Liu | 2018-06-19 |
| 9991440 | Magnetoresistive random access memory cell and fabricating the same | Kuo-Ming Wu, Cheng-Yuan Tsai, Kai-Wen Cheng | 2018-06-05 |