Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10155369 | Wafer debonding system and method | Chang-Chen Tsao, Kuo-Liang Lu, Sheng-Hsiang Chuang, Yu-Hung Cheng, Yeur-Luen Tu +1 more | 2018-12-18 |
| 10138118 | Structure to reduce backside silicon damage | Chung-Yen Chou, Chih-Jen Chan, Chia-Shiung Tsai, Yuan-Chih Hsieh | 2018-11-27 |
| 10134945 | Wafer to wafer bonding techniques for III-V wafers and CMOS wafers | Ming Chyi Liu, Chen-Hua Yu, Chia-Shiung Tsai, Alexander Kalnitsky, Eugene Chen | 2018-11-20 |
| 10079296 | High electron mobility transistor with indium nitride layer | Chen-Hao Chiang, Po-Chun Liu, Chi-Ming Chen, Min-Chang Ching, Chung-Yi Yu +1 more | 2018-09-18 |
| 10049901 | Apparatus and method for wafer level bonding | Ping-Yin Liu, Yen-Chang Chu, Xin-Hua Huang, Lan-Lin Chao, Yeur-Luen Tu | 2018-08-14 |
| 9944516 | High aspect ratio etch without upper widening | Chung-Yen Chou, Chia-Shiung Tsai, Lee-Chuan Tseng | 2018-04-17 |
| 9905751 | Magnetic tunnel junction with reduced damage | Carlos H. Diaz, Harry-Hak-Lay Chuang | 2018-02-27 |
| 9893120 | Semiconductor structure and method of forming the same | Harry-Hak-Lay Chuang, Kuei-Hung Shen, Hsun-Chung Kuang, Cheng-Yuan Tsai | 2018-02-13 |