Issued Patents 2018
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163972 | Image sensing device with photon blocking layer and anti-reflective coating | Hung-Wen Hsu, Jung-I Lin, Ching-Chung Su, Jiech-Fun Lu, Chia-Shiung Tsai | 2018-12-25 |
| 10163949 | Image device having multi-layered refractive layer on back surface | Chih-Yu Lai, Min-Ying Tsai, Hai-Dang Trinh, Cheng-Yuan Tsai | 2018-12-25 |
| 10163947 | Photodiode gate dielectric protection layer | Cheng-Hsien Chou, Wen-I Hsu, Tsun-Kai Tsao, Chih-Yu Lai, Jiech-Fun Lu | 2018-12-25 |
| 10163647 | Method for forming deep trench structure | Min-Ying Tsai, Cheng-Ta Wu | 2018-12-25 |
| 10155369 | Wafer debonding system and method | Chang-Chen Tsao, Kuo-Liang Lu, Ru-Liang Lee, Sheng-Hsiang Chuang, Yu-Hung Cheng +1 more | 2018-12-18 |
| 10147756 | Deep trench isolation structure and method of forming same | Yu-Hung Cheng, Tung-I Lin, Cheng-Lung Wu, Wei-Li Chen | 2018-12-04 |
| 10128113 | Semiconductor structure and manufacturing method thereof | Shih Pei Chou, Chen-Fa Lu, Jiech-Fun Lu, Chia-Shiung Tsai | 2018-11-13 |
| 10109756 | Backside illuminated photo-sensitive device with gradated buffer layer | Yu-Hung Cheng, Chia-Shiung Tsai, Cheng-Ta Wu, Xiaomeng Chen, Yen-Chang Chu | 2018-10-23 |
| 10090196 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao +2 more | 2018-10-02 |
| 10079257 | Anti-reflective layer for backside illuminated CMOS image sensors | Hsing-Lien Lin, Cheng-Yuan Tsai, Cheng-Ta Wu, Chia-Shiung Tsai | 2018-09-18 |
| 10074612 | Method for forming alignment marks and structure of same | Cheng-Hsien Chou, Sheng-Chau Chen, Chun-Wei Chang, Kai-Chun Hsu, Chih-Yu Lai +7 more | 2018-09-11 |
| 10049901 | Apparatus and method for wafer level bonding | Ping-Yin Liu, Yen-Chang Chu, Xin-Hua Huang, Lan-Lin Chao, Ru-Liang Lee | 2018-08-14 |
| 10008531 | Varied STI liners for isolation structures in image sensing devices | Cheng-Hsien Chou, Chia-Shiung Tsai, Feng-Chi Hung, Jiech-Fun Lu, Min-Feng Kao +1 more | 2018-06-26 |
| 9991303 | Image sensor device structure | Hung-Wen Hsu, Ching-Chung Su, Cheng-Hsien Chou, Jiech-Fun Lu, Shih Pei Chou | 2018-06-05 |
| 9978650 | Transistor channel | Yu-Hung Cheng, Ching-Wei Tsai, Tung-I Lin, Wei-Li Chen | 2018-05-22 |
| 9960129 | Hybrid bonding mechanisms for semiconductor wafers | Ping-Yin Liu, Szu-Ying Chen, Chen-Jong Wang, Chih-Hui Huang, Xin-Hua Huang +3 more | 2018-05-01 |
| 9957156 | Bond rings in semiconductor devices and methods of forming same | Chih-Ming Chen, Ping-Yin Liu, Chung-Yi Yu | 2018-05-01 |
| 9941320 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Chia-Chieh Lin +4 more | 2018-04-10 |
| 9917003 | Trench liner passivation for dark current improvement | Cheng-Hsien Chou, Hung-Ling Shih, Tsun-Kai Tsao, Ming-Huei Shen, Kuo-Hwa Tzeng | 2018-03-13 |
| 9917121 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, U-Ting Chen, Shu-Ting Tsai, Hsiu-Yu Cheng | 2018-03-13 |
| 9905600 | Image sensor device and manufacturing method thereof | Yu-Hung Cheng, Tung-I Lin, Cheng-Lung Wu | 2018-02-27 |
| 9899441 | Deep trench isolation (DTI) structure with a tri-layer passivation layer | Yu-Hung Cheng, Cheng-Lung Wu, Tung-I Lin | 2018-02-20 |
| 9887235 | Pixel isolation device and fabrication method | Yu-Hung Cheng, Tung-I Lin, Wei-Li Chen | 2018-02-06 |
| 9871095 | Stacked capacitor with enhanced capacitance and method of manufacturing the same | Szu-Yu Wang, Chih-Yu Lai | 2018-01-16 |
| 9859326 | Semiconductor devices, image sensors, and methods of manufacture thereof | Sheng-Chau Chen, Tung-Ting Wu, Cheng-Ta Wu, Chih-Hui Huang, Jhy-Jyi Sze | 2018-01-02 |