Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096515 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +3 more | 2018-10-09 |
| 10056353 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, U-Ting Chen | 2018-08-21 |
| 9941320 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Shu-Ting Tsai +4 more | 2018-04-10 |