Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157959 | Interconnect structure for stacked device and method | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2018-12-18 |
| 10092768 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2018-10-09 |
| 10090353 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung, Min-Feng Kao | 2018-10-02 |
| 10056353 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Chia-Chieh Lin, U-Ting Chen | 2018-08-21 |
| 9887182 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Cheng-Ying Ho, Sheng-Chau Chen, Shih Pei Chou, Hui-Wen Shen +4 more | 2018-02-06 |
| 9865645 | Interconnect structure for stacked device and method | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2018-01-09 |