Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9887182 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Chun-Chieh Chuang, Sheng-Chau Chen, Shih Pei Chou, Hui-Wen Shen +4 more | 2018-02-06 |
CH
Cheng-Ying Ho
Overall (2018): #461,086 of 503,207Top 95%
1
Patents 2018