Issued Patents 2018
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163956 | Interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shih Pei Chou +2 more | 2018-12-25 |
| 10163973 | Method for forming the front-side illuminated image sensor device structure with light pipe | Feng-Kuei Chang, Keng-Yu Chou, Jen-Cheng Liu | 2018-12-25 |
| 10157958 | Vertically integrated image sensor chips and methods for forming the same | Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen, Wen-De Wang +1 more | 2018-12-18 |
| 10153316 | Mechanisms for forming image sensor device with deep-trench isolation structure | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2018-12-11 |
| 10121812 | Stacked substrate structure with inter-tier interconnection | Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang, Wei-Chih Weng, Yu-Yang Shen | 2018-11-06 |
| 10096515 | Interconnect structure for stacked device | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang +3 more | 2018-10-09 |
| 10092768 | Interconnect structure and method of forming same | Shu-Ting Tsai, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2018-10-09 |
| 10062728 | Image sensor device and method | Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Shuang-Ji Tsai | 2018-08-28 |
| 9941249 | Multi-wafer stacking by Ox-Ox bonding | Shu-Ting Tsai, Szu-Ying Chen, Tzu-Hsuan Hsu, Feng-Chi Hung, Dun-Nian Yaung | 2018-04-10 |
| 9875989 | Semiconductor device structure | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang | 2018-01-23 |
| 9865630 | Image sensor pickup region layout | Dun-Nian Yaung, Ching-Chun Wang, Feng-Chi Hung, Yan-Chih Lu | 2018-01-09 |