Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121812 | Stacked substrate structure with inter-tier interconnection | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang, Wei-Chih Weng | 2018-11-06 |
YS
Yu-Yang Shen
Overall (2018): #176,961 of 503,207Top 40%
1
Patents 2018