Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121812 | Stacked substrate structure with inter-tier interconnection | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang, Yu-Yang Shen | 2018-11-06 |
WW
Wei-Chih Weng
Overall (2018): #196,014 of 503,207Top 40%
1
Patents 2018