Issued Patents 2018
Showing 1–25 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163758 | Semiconductor structure and manufacturing method for the same | Min-Feng Kao, Jen-Cheng Liu, Ching-Chun Wang, Kuan-Chieh Huang, Hsing-Chih Lin +1 more | 2018-12-25 |
| 10163951 | Image sensor device | Szu-Ying Chen, Min-Feng Kao, Jen-Cheng Liu, Feng-Chi Hung | 2018-12-25 |
| 10164133 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Jen-Cheng Liu, Bruce C. S. Chou +2 more | 2018-12-25 |
| 10163956 | Interconnect apparatus and method | Jeng-Shyan Lin, Shu-Ting Tsai, Jen-Cheng Liu, Feng-Chi Hung, Shih Pei Chou +2 more | 2018-12-25 |
| 10163878 | Semiconductor structure and method for manufacturing the same | Min-Feng Kao, Jen-Cheng Liu, Hsing-Chih Lin, Ching-Chun Wang | 2018-12-25 |
| 10157891 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Jen-Cheng Liu, U-Ting Chen, Shih Pei Chou | 2018-12-18 |
| 10157958 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Feng-Chi Hung, Jen-Cheng Liu, Szu-Ying Chen, Wen-De Wang +1 more | 2018-12-18 |
| 10157889 | Stacked semiconductor structure and method | Szu-Ying Chen, Meng-Hsun Wan | 2018-12-18 |
| 10157959 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2018-12-18 |
| 10153316 | Mechanisms for forming image sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Jen-Cheng Liu, Feng-Chi Hung | 2018-12-11 |
| 10147752 | Back-side illuminated (BSI) image sensor with global shutter scheme | Chun-Yuan Chen, Ching-Chun Wang, Shyh-Fann Ting, Wei Chuang Wu, Yen-Ting Chiang +1 more | 2018-12-04 |
| 10147682 | Structure for stacked logic performance improvement | Min-Feng Kao, Jen-Cheng Liu, Hsun-Ying Huang | 2018-12-04 |
| 10141358 | Semiconductor switching device separated by device isolation | Min-Feng Kao, Jen-Cheng Liu, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2018-11-27 |
| 10128304 | Isolation for semiconductor devices | Wen-I Hsu, Min-Feng Kao, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wen-De Wang | 2018-11-13 |
| 10121821 | Biased backside illuminated sensor shield structure | Shyh-Fann Ting, Feng-Chi Hung, Jhy-Jyi Sze, Ching-Chun Wang | 2018-11-06 |
| 10121812 | Stacked substrate structure with inter-tier interconnection | Jeng-Shyan Lin, Jen-Cheng Liu, Hsun-Ying Huang, Wei-Chih Weng, Yu-Yang Shen | 2018-11-06 |
| 10103287 | Semiconductor arrangement and formation thereof | Kai-Chun Hsu, Shyh-Fann Ting, Jhy-Jyi Sze, Chun-Tsung Kuo, Ching-Chun Wang | 2018-10-16 |
| 10096515 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang +3 more | 2018-10-09 |
| 10096645 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Ping-Yin Liu, Calvin Yi-Ping Chao, Tzu-Jui Wang, Jen-Cheng Liu +1 more | 2018-10-09 |
| 10092768 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Chun-Chieh Chuang, Jen-Cheng Liu, Feng-Chi Hung | 2018-10-09 |
| 10090349 | CMOS image sensor chips with stacked scheme and methods for forming the same | Meng-Hsun Wan, Szu-Ying Chen, Jen-Cheng Liu | 2018-10-02 |
| 10090353 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung, Min-Feng Kao | 2018-10-02 |
| 10074612 | Method for forming alignment marks and structure of same | Cheng-Hsien Chou, Sheng-Chau Chen, Chun-Wei Chang, Kai-Chun Hsu, Chih-Yu Lai +7 more | 2018-09-11 |
| 10062721 | Elevated photodiode with a stacked scheme | Meng-Hsun Wan, Yi-Shin Chu, Szu-Ying Chen, Pao-Tung Chen, Jen-Cheng Liu | 2018-08-28 |
| 10062728 | Image sensor device and method | Jeng-Shyan Lin, Feng-Chi Hung, Jen-Cheng Liu, Shuang-Ji Tsai | 2018-08-28 |