Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147752 | Back-side illuminated (BSI) image sensor with global shutter scheme | Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Wei Chuang Wu, Yen-Ting Chiang +1 more | 2018-12-04 |
| 10121821 | Biased backside illuminated sensor shield structure | Feng-Chi Hung, Jhy-Jyi Sze, Ching-Chun Wang, Dun-Nian Yaung | 2018-11-06 |
| 10103287 | Semiconductor arrangement and formation thereof | Kai-Chun Hsu, Jhy-Jyi Sze, Chun-Tsung Kuo, Ching-Chun Wang, Dun-Nian Yaung | 2018-10-16 |
| 10074612 | Method for forming alignment marks and structure of same | Cheng-Hsien Chou, Sheng-Chau Chen, Chun-Wei Chang, Kai-Chun Hsu, Chih-Yu Lai +7 more | 2018-09-11 |
| 10062720 | Deep trench isolation fabrication for BSI image sensor | Yen-Ting Chiang, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Chih-Hui Huang +2 more | 2018-08-28 |
| 10014340 | Stacked SPAD image sensor | Ming-Hsien Yang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Chun-Yuan Chen | 2018-07-03 |
| 9954022 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze +4 more | 2018-04-24 |
| 9917130 | Image sensor with reduced optical path | Ching-Chun Wang, Chen-Jong Wang, Jhy-Jyi Sze, Chun-Ming Su, Wei Chuang Wu +1 more | 2018-03-13 |
| 9887182 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Cheng-Ying Ho, Chun-Chieh Chuang, Sheng-Chau Chen, Shih Pei Chou +4 more | 2018-02-06 |