Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134801 | Method of forming deep trench isolation in radiation sensing substrate and image sensor device | Chi-Ming Lu, Jung-Chih Tsao, Yao-Hsiang Liang, Chih-Chang Huang, Ching-Ho Hsu | 2018-11-20 |
| 10096515 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +3 more | 2018-10-09 |
| 10062656 | Composite bond structure in stacked semiconductor structure | Chao-Ching Chang, Sheng-Chan Li, Wen-Jen Tsai, Jian-Shin Tsai, Cheng-Yi Wu +2 more | 2018-08-28 |
| 10062720 | Deep trench isolation fabrication for BSI image sensor | Yen-Ting Chiang, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Shyh-Fann Ting +2 more | 2018-08-28 |
| 9960129 | Hybrid bonding mechanisms for semiconductor wafers | Ping-Yin Liu, Szu-Ying Chen, Chen-Jong Wang, Xin-Hua Huang, Lan-Lin Chao +3 more | 2018-05-01 |
| 9960200 | Selective deposition and planarization for a CMOS image sensor | Sheng-Chan Li, Cheng-Hsien Chou, Sheng-Chau Chen, Cheng-Yuan Tsai | 2018-05-01 |
| 9859326 | Semiconductor devices, image sensors, and methods of manufacture thereof | Sheng-Chau Chen, Tung-Ting Wu, Cheng-Ta Wu, Yeur-Luen Tu, Jhy-Jyi Sze | 2018-01-02 |