Issued Patents 2018
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163758 | Semiconductor structure and manufacturing method for the same | Min-Feng Kao, Dun-Nian Yaung, Ching-Chun Wang, Kuan-Chieh Huang, Hsing-Chih Lin +1 more | 2018-12-25 |
| 10164133 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Bruce C. S. Chou +2 more | 2018-12-25 |
| 10163973 | Method for forming the front-side illuminated image sensor device structure with light pipe | Feng-Kuei Chang, Keng-Yu Chou, Jeng-Shyan Lin | 2018-12-25 |
| 10163956 | Interconnect apparatus and method | Jeng-Shyan Lin, Shu-Ting Tsai, Dun-Nian Yaung, Feng-Chi Hung, Shih Pei Chou +2 more | 2018-12-25 |
| 10163951 | Image sensor device | Szu-Ying Chen, Min-Feng Kao, Feng-Chi Hung, Dun-Nian Yaung | 2018-12-25 |
| 10163878 | Semiconductor structure and method for manufacturing the same | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Ching-Chun Wang | 2018-12-25 |
| 10157958 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung, Szu-Ying Chen, Wen-De Wang +1 more | 2018-12-18 |
| 10157959 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2018-12-18 |
| 10157891 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, U-Ting Chen, Shih Pei Chou | 2018-12-18 |
| 10153316 | Mechanisms for forming image sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Dun-Nian Yaung, Feng-Chi Hung | 2018-12-11 |
| 10147682 | Structure for stacked logic performance improvement | Min-Feng Kao, Dun-Nian Yaung, Hsun-Ying Huang | 2018-12-04 |
| 10141358 | Semiconductor switching device separated by device isolation | Min-Feng Kao, Dun-Nian Yaung, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2018-11-27 |
| 10134794 | Image sensor chip sidewall interconnection | Kuo-Chin Huang, Pao-Tung Chen, Wei-Chieh Chiang, Kazuaki Hashimoto | 2018-11-20 |
| 10128304 | Isolation for semiconductor devices | Wen-I Hsu, Min-Feng Kao, Dun-Nian Yaung, Tzu-Hsuan Hsu, Wen-De Wang | 2018-11-13 |
| 10121812 | Stacked substrate structure with inter-tier interconnection | Jeng-Shyan Lin, Dun-Nian Yaung, Hsun-Ying Huang, Wei-Chih Weng, Yu-Yang Shen | 2018-11-06 |
| 10092768 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Chun-Chieh Chuang, Dun-Nian Yaung, Feng-Chi Hung | 2018-10-09 |
| 10096515 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Feng-Chi Hung, Chih-Hui Huang +3 more | 2018-10-09 |
| 10096645 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Ping-Yin Liu, Calvin Yi-Ping Chao, Tzu-Jui Wang, Dun-Nian Yaung +1 more | 2018-10-09 |
| 10090353 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Dun-Nian Yaung, Tzu-Hsuan Hsu, Feng-Chi Hung, Min-Feng Kao | 2018-10-02 |
| 10090349 | CMOS image sensor chips with stacked scheme and methods for forming the same | Meng-Hsun Wan, Szu-Ying Chen, Dun-Nian Yaung | 2018-10-02 |
| 10062728 | Image sensor device and method | Jeng-Shyan Lin, Dun-Nian Yaung, Feng-Chi Hung, Shuang-Ji Tsai | 2018-08-28 |
| 10062721 | Elevated photodiode with a stacked scheme | Meng-Hsun Wan, Yi-Shin Chu, Szu-Ying Chen, Pao-Tung Chen, Dun-Nian Yaung | 2018-08-28 |
| 10056353 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Chun-Chieh Chuang, Chia-Chieh Lin, U-Ting Chen | 2018-08-21 |
| 10049981 | Through via structure, semiconductor device and manufacturing method thereof | Hsin-Hung Chen, Min-Feng Kao, Hsing-Chih Lin, Dun-Nian Yaung | 2018-08-14 |
| 10008532 | Implant isolated devices and method for forming the same | Min-Feng Kao, Dun-Nian Yaung, Tzu-Hsuan Hsu, Wen-De Wang, Wen-I Hsu | 2018-06-26 |