Issued Patents 2018
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10160638 | Method and apparatus for a semiconductor structure | Li-Cheng Chu, Xin-Hua Huang, Yuan-Chih Hsieh, Lan-Lin Chao, Chun-Wen Cheng | 2018-12-25 |
| 10128209 | Wafer bonding process and structure | Lan-Lin Chao, Cheng-Tai Hsiao, Xin-Hua Huang, Hsun-Chung Kuang | 2018-11-13 |
| 10103122 | Hybrid bonding systems and methods for semiconductor wafers | Shih-Wei Lin, Xin-Hua Huang, Lan-Lin Chao, Chia-Shiung Tsai | 2018-10-16 |
| 10096645 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Calvin Yi-Ping Chao, Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung +1 more | 2018-10-09 |
| 10090196 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Lan-Lin Chao, Yeur-Luen Tu +2 more | 2018-10-02 |
| 10049901 | Apparatus and method for wafer level bonding | Yen-Chang Chu, Xin-Hua Huang, Lan-Lin Chao, Yeur-Luen Tu, Ru-Liang Lee | 2018-08-14 |
| 10037968 | Alignment systems and wafer bonding systems and methods | Xin-Hua Huang, Xiaomeng Chen, Lan-Lin Chao | 2018-07-31 |
| 10012899 | Graphene pellicle for extreme ultraviolet lithography | Chih-Chiang Tu, Chun-Lang Chen, Chue-San Yoo, Jong-Yuh Chang, Chia-Shiung Tsai +3 more | 2018-07-03 |
| 9960129 | Hybrid bonding mechanisms for semiconductor wafers | Szu-Ying Chen, Chen-Jong Wang, Chih-Hui Huang, Xin-Hua Huang, Lan-Lin Chao +3 more | 2018-05-01 |
| 9957156 | Bond rings in semiconductor devices and methods of forming same | Chih-Ming Chen, Chung-Yi Yu, Yeur-Luen Tu | 2018-05-01 |
| 9953847 | Apparatus and method for cleaning | Xin-Hua Huang, Lan-Lin Chao | 2018-04-24 |
| 9917069 | Hybrid bonding system and cleaning method thereof | Yeong-Jyh Lin, Xin-Hua Huang, Chia-Shiung Tsai | 2018-03-13 |
| 9887155 | Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same | Kai-Wen Cheng, Xin-Hua Huang, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen | 2018-02-06 |