Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115896 | Semiconductor device and method of manufacturing the same | Hai-Dang Trinh, Yao-Wen Chang, Cheng-Yuan Tsai, Chin-Wei Liang | 2018-10-30 |
| 10109756 | Backside illuminated photo-sensitive device with gradated buffer layer | Yu-Hung Cheng, Chia-Shiung Tsai, Cheng-Ta Wu, Xiaomeng Chen, Yeur-Luen Tu | 2018-10-23 |
| 10090196 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu +2 more | 2018-10-02 |
| 10049901 | Apparatus and method for wafer level bonding | Ping-Yin Liu, Xin-Hua Huang, Lan-Lin Chao, Yeur-Luen Tu, Ru-Liang Lee | 2018-08-14 |
| 10043705 | Memory device and method of forming thereof | Yao-Wen Chang, Sheng-Chau Chen, Alexander Kalnitsky | 2018-08-07 |