Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163651 | Structure and method to expose memory cells with different sizes | Sheng-Chau Chen, Cheng-Yuan Tsai, Hsun-Chung Kuang, Yao-Wen Chang | 2018-12-25 |
| 10128209 | Wafer bonding process and structure | Ping-Yin Liu, Lan-Lin Chao, Xin-Hua Huang, Hsun-Chung Kuang | 2018-11-13 |
| 10090196 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Yen-Chang Chu, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu +2 more | 2018-10-02 |