Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163651 | Structure and method to expose memory cells with different sizes | Sheng-Chau Chen, Cheng-Tai Hsiao, Cheng-Yuan Tsai, Yao-Wen Chang | 2018-12-25 |
| 10128209 | Wafer bonding process and structure | Ping-Yin Liu, Lan-Lin Chao, Cheng-Tai Hsiao, Xin-Hua Huang | 2018-11-13 |
| 10090196 | 3D integrated circuit and methods of forming the same | Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu +2 more | 2018-10-02 |
| 9893120 | Semiconductor structure and method of forming the same | Harry-Hak-Lay Chuang, Kuei-Hung Shen, Cheng-Yuan Tsai, Ru-Liang Lee | 2018-02-13 |