Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10160638 | Method and apparatus for a semiconductor structure | Li-Cheng Chu, Ping-Yin Liu, Xin-Hua Huang, Lan-Lin Chao, Chun-Wen Cheng | 2018-12-25 |
| 10138118 | Structure to reduce backside silicon damage | Chung-Yen Chou, Chih-Jen Chan, Chia-Shiung Tsai, Ru-Liang Lee | 2018-11-27 |
| 10119909 | Biological sensing structures | Hung-Hua Lin, Li-Cheng Chu, Ming-Tung Wu, Lan-Lin Chao, Chia-Shiung Tsai | 2018-11-06 |
| 10053361 | Method of selectively removing an anti-stiction layer on a eutectic bonding area | Hung-Hua Lin, Wen-Chuan Tai, Hsiang-Fu Chen | 2018-08-21 |
| 9975757 | Wafer Level Hermetic Seal Process for microelectromechanical systems (MEMS) devices | Lee-Chuan Tseng, Chung-Yen Chou, Shih-Chang Liu | 2018-05-22 |
| 9878899 | Method and apparatus for reducing in-process and in-use stiction for MEMS devices | Lee-Chuan Tseng, Chang-Ming Wu, Shih-Chang Liu | 2018-01-30 |
| 9873610 | Multiple bonding in wafer level packaging | Chung-Hsien Lin, Chia-Hua Chu, Li-Cheng Chu, Chun-Wen Cheng | 2018-01-23 |