Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10161817 | Reduced stress pressure sensor | Felix Mayer, Marc Von Waldkirch, Johannes Buhler, Rene Hummel, Stephan Braun +1 more | 2018-12-25 |
| 10160633 | MEMS devices and fabrication methods thereof | Chia-Hua Chu, Chun-Wen Cheng, Te-Hao Lee | 2018-12-25 |
| 10155655 | MEMS devices and fabrication methods thereof | Chia-Hua Chu, Chun-Wen Cheng, Te-Hao Lee | 2018-12-18 |
| 10134552 | Method for fabricating MEMS switch with reduced dielectric charging effect | Chia-Hua Chu, Chun-Wen Cheng | 2018-11-20 |
| 10099919 | MEMS devices and methods of forming same | Kai-Chih Liang, Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee | 2018-10-16 |
| 10087069 | Semiconductor devices with moving members and methods for making the same | Chia-Hua Chu, Kuei-Sung Chang | 2018-10-02 |
| 9958349 | Pressure sensor | Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel +3 more | 2018-05-01 |
| 9873610 | Multiple bonding in wafer level packaging | Chia-Hua Chu, Li-Cheng Chu, Yuan-Chih Hsieh, Chun-Wen Cheng | 2018-01-23 |