Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10131540 | Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications | Shao-Chi Yu, Chia-Ming Hung, Hsin-Ting Huang, Hsiang-Fu Chen, Allen Timothy Chang | 2018-11-20 |
| 10053361 | Method of selectively removing an anti-stiction layer on a eutectic bonding area | Yuan-Chih Hsieh, Hung-Hua Lin, Hsiang-Fu Chen | 2018-08-21 |
| 9856139 | Microelectromechanical systems (MEMS) devices at different pressures | Hsin-Ting Huang, Hsiang-Fu Chen, Shao-Chi Yu, Chia-Ming Hung, Allen Timothy Chang +2 more | 2018-01-02 |