Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10131540 | Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications | Shao-Chi Yu, Hsin-Ting Huang, Hsiang-Fu Chen, Allen Timothy Chang, Wen-Chuan Tai | 2018-11-20 |
| 9856139 | Microelectromechanical systems (MEMS) devices at different pressures | Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai, Shao-Chi Yu, Allen Timothy Chang +2 more | 2018-01-02 |