Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10145847 | Method for forming biochips and biochips with non-organic landings for improved thermal budget | Chia-Hua Chu, Ching-Ray Chen, Yi-Hsien Chang, Yi-Shao Liu, Chun-Ren Cheng +1 more | 2018-12-04 |
| 10131540 | Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications | Shao-Chi Yu, Chia-Ming Hung, Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai | 2018-11-20 |
| 9968927 | Optical biosensor device | Yi-Shao Liu, Emerson Cheng, Yi-Hsien Chang, Chun-Ren Cheng, Ching-Ray Chen +1 more | 2018-05-15 |
| 9856139 | Microelectromechanical systems (MEMS) devices at different pressures | Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai, Shao-Chi Yu, Chia-Ming Hung +2 more | 2018-01-02 |