Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10155660 | Device and method for protecting FEOL element and BEOL element | Ping-Chun Yeh, Lien-Yao Tsai | 2018-12-18 |
| 10131540 | Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications | Chia-Ming Hung, Hsin-Ting Huang, Hsiang-Fu Chen, Allen Timothy Chang, Wen-Chuan Tai | 2018-11-20 |
| 10049941 | Semiconductor isolation structure with air gaps in deep trenches | Hong-Seng Shue, Tai-I Yang, Wei-Ding Wu, Ming-Tai Chung | 2018-08-14 |
| 9856139 | Microelectromechanical systems (MEMS) devices at different pressures | Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai, Chia-Ming Hung, Allen Timothy Chang +2 more | 2018-01-02 |