Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163690 | 2-D interconnections for integrated circuits | Chia-Tien Wu, Hsiang-Wei Liu, Wei-Chen Chu | 2018-12-25 |
| 10103102 | Structure and formation method of semiconductor device structure | Jian-Hua Chen, Cheng-Chi Chuang, Chia-Tien Wu, Tien-Lu Lin, Tien-I Bao | 2018-10-16 |
| 10074607 | Semiconductor device structure with graphene layer | Tien-I Bao, Tien-Lu Lin, Wei-Chen Chu | 2018-09-11 |
| 10049941 | Semiconductor isolation structure with air gaps in deep trenches | Hong-Seng Shue, Wei-Ding Wu, Ming-Tai Chung, Shao-Chi Yu | 2018-08-14 |
| 10026647 | Multi-metal fill with self-align patterning | Wei-Chen Chu, Cheng-Chi Chuang, Chia-Tien Wu | 2018-07-17 |
| 10002826 | Semiconductor device structure with conductive pillar and conductive line and method for forming the same | Yu-Chieh Liao, Tien-Lu Lin, Tien-I Bao | 2018-06-19 |
| 10000373 | Nano-electromechanical system (NEMS) device structure and method for forming the same | Hsin-Ping Chen, Carlos H. Diaz, Ken-Ichi Goto, Shau-Lin Shue | 2018-06-19 |
| 9875967 | Interconnect structure with air-gaps | Cheng-Chi Chuang, Yung-Chih Wang, Tien-Lu Lin | 2018-01-23 |
| 9865539 | Structure and formation method of semiconductor device structure | Jian-Hua Chen, Cheng-Chi Chuang, Chia-Tien Wu, Tien-Lu Lin, Tien-I Bao | 2018-01-09 |